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Author statistics

Author Identifier Number of Items Total Downloads
Nogita, K https://orcid.org/0000-0002-0721-6600 20 1313

Items

Title Author(s) IrusType Repository Item URL Total Downloads
A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods Salleh, Mohd Arif Anuar Mohd; Al Bakri, Abdullah Mohd Mustafa; Somidin, Flora; Sandu, Andrei Victor; Saud, Norainiza; Kamaruddin, Hussin; McDonald, Stuart D.; Nogita, Kazuhiro Article University of Queensland [UQ eSpace] https://espace.library.uq.edu.au/view/UQ:308651 1
A real-time synchrotron X-ray study of primary phase nucleation and formation in hypoeutectic Al–Si alloys Prasad, Arvind; Macdonald, Stuart D.; Yasuda, Hideyuki; Nogita, Kazuhiro; StJohn, David Article University of Queensland [UQ eSpace] https://espace.library.uq.edu.au/view/UQ:368070 105
Atomic locations of minor dopants and their roles in the stabilization of η−Cu6Sn5 Yang, Wenhui; Quy Tran, Xuan; Yamamoto, Tomokazu; Yoshioka, Satoru; Somidin, Flora; Nogita, Kazuhiro; Matsumura, Syo Article University of Queensland [UQ eSpace] 39
Characterisation of hydrogen release behaviour in cast Mg-Ni alloys by synchrotron XRD and XAFS Nogita, Kazuhiro; Jenke, Marc; Wood, David; Duguid, Andrew; McDonald, Stuart D. Conference Papers/Posters University of Queensland [UQ eSpace] https://espace.library.uq.edu.au/view/UQ:229547 2
Comparison of solidification behavior between in situ observation and simulation of Fe-C-Si system Henao, Hector M.; Sugiyama, Akira; Nogita, Kazuhiro Article University of Queensland [UQ eSpace] https://espace.library.uq.edu.au/view/UQ:335061 78
Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review Mu, D.K.; McDonald, S.D.; Read, J.; Huang, H.; Nogita, K. Article University of Queensland [UQ eSpace] https://espace.library.uq.edu.au/view/UQ:382015 88
Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process Mohd Salleh, M.A.A.; McDonald, S.D.; Gourlay, C.M.; Belyakov, S.A.; Yasuda, H.; Nogita, K. Article University of Queensland [UQ eSpace] https://espace.library.uq.edu.au/view/UQ:372618 27
Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates Mohd Salleh, M. A. A.; McDonald, S. D.; Nogita, K. Article University of Queensland [UQ eSpace] https://espace.library.uq.edu.au/view/UQ:416160 94
In situ studies revealing dendrite and eutectic growth during the solidification of Sn-0.7Cu-0.5Ag Pb-free solder alloy Zeng, G.; Callaghan, M. D.; McDonald, S. D.; Yasuda, H.; Nogita, K. Article University of Queensland [UQ eSpace] 3
Kinetics of the β → α transformation of tin: role of α-tin nucleation Zeng, Guang; McDonald, Stuart D.; Gu, Qinfen; Matsumura, Syo; Nogita, Kazuhiro Article University of Queensland [UQ eSpace] https://espace.library.uq.edu.au/view/UQ:375621 33
Lead-free solders for electric vehicles - Global Green Challenge: Eco-challenge racing Nogita, K.; Greaves, M.; Guymer, B.; Walsh, B.; Kennedy, J.; Duke, M.; Nishimura, T. Conference Papers/Posters University of Queensland [UQ eSpace] https://espace.library.uq.edu.au/view/UQ:229563 153
Microstructure control in Sn-0.7mass%Cu alloys Nogita, Kazuhiro; Read, Jonathan; Nishimura, Tetsuro; Sweatman, Keith; Suenaga, Shoichi; Dahle, Arne K. Article University of Queensland [UQ eSpace] https://espace.library.uq.edu.au/view/UQ:77688 26
Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review Mohd Salleh, M. A. A.; McDonald, Stuart; Nogita, Kazuhiro Conference Papers/Posters University of Queensland [UQ eSpace] https://espace.library.uq.edu.au/view/UQ:313129 3
Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of Ni Mehreen, Syeda U.; Nogita, Kazuhiro; McDonald, Stuart; Yasuda, Hideyuki; St John, David Article University of Queensland [UQ eSpace] 69
Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles Salleh, M. A. A. Mohd; McDonald, S. D.; Gourlay, C. M.; Yasuda, H.; Nogita, K. Article University of Queensland [UQ eSpace] https://espace.library.uq.edu.au/view/UQ:408272 88
The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints Zeng, Guang; McDonald, Stuart D.; Mu, Dekui; Terada, Yasuko; Yasuda, Hideyuki; Gu, Qinfen; Salleh, M. A. A. Mohd; Nogita, Kazuhiro Article University of Queensland [UQ eSpace] https://espace.library.uq.edu.au/view/UQ:408286 108
The influence of Ni additions on the relative stability of eta and eta(') Cu6Sn5 Schwingenschlogl, U.; Di Paola, C.; Nogita, K.; Gourlay, C. M. Article University of Queensland [UQ eSpace] https://espace.library.uq.edu.au/view/UQ:197120 103
Tin pest in lead-free solders? Fundamental studies on the effect of impurities on phase transformation kinetics Zeng, Guang; McDonald, Stuart D.; Sweatman, Keith; Nogita, Kazuhiro Conference Papers/Posters University of Queensland [UQ eSpace] https://espace.library.uq.edu.au/view/UQ:335134 1
Trace element distribution in solder joints between Sn-based solders and Cu substrates Nogita, K.; Yasuda, H.; Gourlay, C. M.; Suenaga, S.; Tsukamoto, H.; McDonald, S. D.; Takeuchi, A.; Uesugi, K.; Suzuki, Y. Conference Papers/Posters University of Queensland [UQ eSpace] https://espace.library.uq.edu.au/view/UQ:229558 2
Understanding the Origin of Li2MnO3 Activation in Li-Rich Cathode Materials for Lithium-Ion Batteries Ye, Delai; Zeng, Guang; Nogita, Kazuhiro; Ozawa, Kiyoshi; Hankel, Marlies; Searles, Debra J; Wang, Lianzhou Article University of Queensland [UQ eSpace] https://espace.library.uq.edu.au/view/UQ:377028 290
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