Title |
Author(s) |
IrusType |
Repository |
Item URL |
Total Downloads |
A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods |
Salleh, Mohd Arif Anuar Mohd; Al Bakri, Abdullah Mohd Mustafa; Somidin, Flora; Sandu, Andrei Victor; Saud, Norainiza; Kamaruddin, Hussin; McDonald, Stuart D.; Nogita, Kazuhiro |
Article |
University of Queensland [UQ eSpace] |
https://espace.library.uq.edu.au/view/UQ:308651 |
1 |
A real-time synchrotron X-ray study of primary phase nucleation and formation in hypoeutectic Al–Si alloys |
Prasad, Arvind; Macdonald, Stuart D.; Yasuda, Hideyuki; Nogita, Kazuhiro; StJohn, David |
Article |
University of Queensland [UQ eSpace] |
https://espace.library.uq.edu.au/view/UQ:368070 |
105 |
Atomic locations of minor dopants and their roles in the stabilization of η−Cu6Sn5 |
Yang, Wenhui; Quy Tran, Xuan; Yamamoto, Tomokazu; Yoshioka, Satoru; Somidin, Flora; Nogita, Kazuhiro; Matsumura, Syo |
Article |
University of Queensland [UQ eSpace] |
|
39 |
Characterisation of hydrogen release behaviour in cast Mg-Ni alloys by synchrotron XRD and XAFS |
Nogita, Kazuhiro; Jenke, Marc; Wood, David; Duguid, Andrew; McDonald, Stuart D. |
Conference Papers/Posters |
University of Queensland [UQ eSpace] |
https://espace.library.uq.edu.au/view/UQ:229547 |
2 |
Comparison of solidification behavior between in situ observation and simulation of Fe-C-Si system |
Henao, Hector M.; Sugiyama, Akira; Nogita, Kazuhiro |
Article |
University of Queensland [UQ eSpace] |
https://espace.library.uq.edu.au/view/UQ:335061 |
78 |
Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review |
Mu, D.K.; McDonald, S.D.; Read, J.; Huang, H.; Nogita, K. |
Article |
University of Queensland [UQ eSpace] |
https://espace.library.uq.edu.au/view/UQ:382015 |
88 |
Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process |
Mohd Salleh, M.A.A.; McDonald, S.D.; Gourlay, C.M.; Belyakov, S.A.; Yasuda, H.; Nogita, K. |
Article |
University of Queensland [UQ eSpace] |
https://espace.library.uq.edu.au/view/UQ:372618 |
27 |
Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates |
Mohd Salleh, M. A. A.; McDonald, S. D.; Nogita, K. |
Article |
University of Queensland [UQ eSpace] |
https://espace.library.uq.edu.au/view/UQ:416160 |
94 |
In situ studies revealing dendrite and eutectic growth during the solidification of Sn-0.7Cu-0.5Ag Pb-free solder alloy |
Zeng, G.; Callaghan, M. D.; McDonald, S. D.; Yasuda, H.; Nogita, K. |
Article |
University of Queensland [UQ eSpace] |
|
3 |
Kinetics of the β → α transformation of tin: role of α-tin nucleation |
Zeng, Guang; McDonald, Stuart D.; Gu, Qinfen; Matsumura, Syo; Nogita, Kazuhiro |
Article |
University of Queensland [UQ eSpace] |
https://espace.library.uq.edu.au/view/UQ:375621 |
33 |
Lead-free solders for electric vehicles - Global Green Challenge: Eco-challenge racing |
Nogita, K.; Greaves, M.; Guymer, B.; Walsh, B.; Kennedy, J.; Duke, M.; Nishimura, T. |
Conference Papers/Posters |
University of Queensland [UQ eSpace] |
https://espace.library.uq.edu.au/view/UQ:229563 |
153 |
Microstructure control in Sn-0.7mass%Cu alloys |
Nogita, Kazuhiro; Read, Jonathan; Nishimura, Tetsuro; Sweatman, Keith; Suenaga, Shoichi; Dahle, Arne K. |
Article |
University of Queensland [UQ eSpace] |
https://espace.library.uq.edu.au/view/UQ:77688 |
26 |
Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review |
Mohd Salleh, M. A. A.; McDonald, Stuart; Nogita, Kazuhiro |
Conference Papers/Posters |
University of Queensland [UQ eSpace] |
https://espace.library.uq.edu.au/view/UQ:313129 |
3 |
Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of Ni |
Mehreen, Syeda U.; Nogita, Kazuhiro; McDonald, Stuart; Yasuda, Hideyuki; St John, David |
Article |
University of Queensland [UQ eSpace] |
|
69 |
Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles |
Salleh, M. A. A. Mohd; McDonald, S. D.; Gourlay, C. M.; Yasuda, H.; Nogita, K. |
Article |
University of Queensland [UQ eSpace] |
https://espace.library.uq.edu.au/view/UQ:408272 |
88 |
The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints |
Zeng, Guang; McDonald, Stuart D.; Mu, Dekui; Terada, Yasuko; Yasuda, Hideyuki; Gu, Qinfen; Salleh, M. A. A. Mohd; Nogita, Kazuhiro |
Article |
University of Queensland [UQ eSpace] |
https://espace.library.uq.edu.au/view/UQ:408286 |
108 |
The influence of Ni additions on the relative stability of eta and eta(') Cu6Sn5 |
Schwingenschlogl, U.; Di Paola, C.; Nogita, K.; Gourlay, C. M. |
Article |
University of Queensland [UQ eSpace] |
https://espace.library.uq.edu.au/view/UQ:197120 |
103 |
Tin pest in lead-free solders? Fundamental studies on the effect of impurities on phase transformation kinetics |
Zeng, Guang; McDonald, Stuart D.; Sweatman, Keith; Nogita, Kazuhiro |
Conference Papers/Posters |
University of Queensland [UQ eSpace] |
https://espace.library.uq.edu.au/view/UQ:335134 |
1 |
Trace element distribution in solder joints between Sn-based solders and Cu substrates |
Nogita, K.; Yasuda, H.; Gourlay, C. M.; Suenaga, S.; Tsukamoto, H.; McDonald, S. D.; Takeuchi, A.; Uesugi, K.; Suzuki, Y. |
Conference Papers/Posters |
University of Queensland [UQ eSpace] |
https://espace.library.uq.edu.au/view/UQ:229558 |
2 |
Understanding the Origin of Li2MnO3 Activation in Li-Rich Cathode Materials for Lithium-Ion Batteries |
Ye, Delai; Zeng, Guang; Nogita, Kazuhiro; Ozawa, Kiyoshi; Hankel, Marlies; Searles, Debra J; Wang, Lianzhou |
Article |
University of Queensland [UQ eSpace] |
https://espace.library.uq.edu.au/view/UQ:377028 |
290 |