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Item Statistics

Enhancement on wettability and intermetallic compound formation with an addition of Al on Sn-0.7Cu lead-free solder fabricated via powder metallurgy method

RepositoryUniversity of Queensland [UQ eSpace]
URL
Author(s)Adli, Nisrin; Razak, Nurul Razliana Abdul; Saud, Norainiza
Item TypeConference Papers/Posters
JournalAIP Conference Proceedings, Print_ISSN:0094-243X
DOIhttps://doi.org/10.1063/1.4958777

Usage Date Range

     

Reporting Period Total Aug-2020 Sep-2020 Oct-2020 Nov-2020 Dec-2020 Jan-2021 Feb-2021 Mar-2021 Apr-2021 May-2021 Jun-2021 Jul-2021 Aug-2021 Sep-2021 Oct-2021 Nov-2021 Dec-2021
30 1 0 0 0 1 1 0 0 0 1 0 0 1 2 11 9 3

Average downloads per month for selected period: 1.8

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