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Item Statistics
Enhancement on wettability and intermetallic compound formation with an addition of Al on Sn-0.7Cu lead-free solder fabricated via powder metallurgy method
Repository | University of Queensland [UQ eSpace] |
URL | |
Author(s) | Adli, Nisrin; Razak, Nurul Razliana Abdul; Saud, Norainiza |
Item type | Conference Papers/Posters |
Journal | AIP Conference Proceedings, Print_ISSN:0094-243X |
DOI | https://doi.org/10.1063/1.4958777 |